DSH Thick 800A Plating Thickness Analyzer

DSH Thick 800A Plating Thickness Tester

I. Instrument introduction

DSH Thick800A incorporates Dshing’s many years in plating thickness measurement with full-auto software operation, multi-point testing, software controlling the instrument and movable platform. It is a powerful instrument equipped with special software and widely applied in plating industries.

II. Performance characteristics

1. Top-lightening

2. Test parts can be lifted up and down

3. High-precision moveable platform

4. Small collimator

5. High-resolution detector

6. Visual operation

7. Auto locate height

8. Auto search spot

9. Mouse locates the test point

10. Well ray shielding

11. Super large chamber design

12. Safe protection of test interface

III. Technical specifications

1. Analytical range: from S to U

2. Simultaneous analysis of at most 24 elements or coating of above 5 layers

3. Detection limit: 2ppm, analytical content: 2ppm to 99.9%

4. Coating thickness: 0.005um minimum, within 20um (it depends on different materials)

5. Micro collimator (minimum diameter: 0.1mm), test spot (within 0.2mm)

6. High-precision movable platform (position accuracy: below 0.005mm)

7. Arbitrary multiple optional analysis and identification models

8. Independent matrix effect correction models

9. Repeatability of multiple analyses reaches 0.05um (outermost layer Au below 1um)

10. Working stability over a long period: 0.1um (outermost layer Au below 1um)

11. Temperature range: 15°C to 30°C

12. Power: AC220V±5V, AC purified stabilized voltage power is recommended

13. Size: 576×495×545 mm

14. Weight: 90kg

IV. Standard configurations

1. Open sample chamber

2. Precise 2-D movable sample platform; the detection system can lift up and down to realize 3-D movement.

3. Double-laser locating device

4. Organic glass shielding cover

5. Si-Pin detector

6. Signal detection circuit

7. High-voltage power

8. X-ray tube

9. Altitude transducer

10. Protection transducer

V. Application fields

1. Detection for golden, platinum, silver, other precious metals and various jewelries content

2. Detection for plating thickness of metals, content of plating solution and plating

3. Mainly applied in precious metal and jewelry processing industries; bank, jewelry selling and detection institution, electroplating industries

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